Seeed
110060871 Educational Kits
110060871
939-110060871
Seeed-110060871-datasheets-5334066.pdf
UP GROVE IOT DEVELOPMENT KIT
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110060871 Description
Tech Specifications
Main Purpose
Suggested Programming Environment
Kit Type
ECCN
Product Status
Interconnect System
Series
Included MCU/MPU Board(s)
Mfr
Utilized IC / Part
HTSUS
Package
Moisture Sensitivity Level (MSL)
110060871 Documents
Download datasheets and manufacturer documentation for 110060871
110060871 110060871 Related Parts
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Shopping Guide
Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service
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